KELA 0172 IPC-A-610F Acceptability of Electronic Assemblies IPC 1-580986-28-5 KELA 0151 Pace High Reliability Interconnection Technology Handbook PACE 5050-0082 Pace Workbook Basic Soldering for Electronics PACE 5050-0083 KET2 0109 Introductory Mathematics, 4th.

Basic Soldering For Electronics Pace Handbook Of North Dakota
Basic Soldering For Electronics Pace Handbook Of North Usa
Basic Soldering For Electronics Pace Handbook Of North Carolina
Basic Soldering For Electronics Pace Pdf

With 60/40 solder, the range is much smaller than it is for 50/50 solder. The 63/37 ratio, known as eutectic solder has practically no plastic range, and melts almost instantly at 183 C -361 F. The solders most commonly used for hand soldering in electronics are the 60/40 type and the 63/37 type. Army Publishing Directorate Army Publishing Directorate. . What is the appropriate temperature for soldering? Joint area temperature = The M.P of solder alloy+4050 Degree C. Sn60% Solder (190Degree C) +4050 Degree C =230240 Degree C. However the iron will be set much hotter @350-450 ºC. The hotter the iron the faster the joint can be made providing the heat transfer from it is good.

Glenn Blackwell

Purdue University

Electrical & Computer Engineering Technology Dept.

UTEC SMT Course 2014 Web Page

Basic Soldering For Electronics Pace Handbook Of North Dakota

The Universidad De Ingenieria & Technologia (UTEC) in Lima, Peru, is a new engineering university in South America. Their web site is www.utec.edu.pe.Electronics is an important part of their curriculum, so together we have developed a short course on Surface Mount Technology (SMT) to introduce their students to three aspects of the use of SMT:

vBasics of SMT components and assembly processes

vPCB design using SMT components, including high-current and high-speed circuits

vBasic hand assembly, assisted hand assembly, and rework/repair of SMT-based assemblies.

The text for the course is Blackwell & Hollomon, Surface-Mount Technology for PC Boards, 2^nd edition, Thompson/Delmar Learning, 2006.

Here is the errata sheet for the text: B&H Errata

The reason for the course is the continuing increase in the impact of electronics in many areas of technology. An example of electronics’ impact on the automotive industry is here: Automotive Electronics

Here is a basic introduction to surface mount technology, courtesy of Radio-Electronics magazine: R-E SMT Introduction

Cross-section of an example PC board, which shows how SMT components allow easier routing, and in many cases fewer layers, than through-hole technology (THT) components.

THT component leads require that every layer be clear of the hole, while SMT components only affect routing on the surface layer to which they will be soldered.

The course will consist of morning and afternoon lectures, and morning and afternoon laboratories.

```

`SMT decoupling caps on the bottom of a BGA board.

References for the course, in addition to the textbook, include:

vIntel Packaging Handbook: http://www.intel.com/design/packtech/packbook.htm, chapter 1 “Component Surface Mount Technology”, and chapter 2 “SMT Board Assembly Recommendations”.

vTexas Instruments basic SMT component handling, process recommendations, and basic repair/rework recommendations: TI AN-2029

vSilicon Laboratories Application Note on hand soldering QFP packages: Hand Soldering Tutorial for Fine Pitch QFP Devices

vConceptronic Reflow Technology Handbook: Conceptronic RT Handbook

LLP/QFN, one of the newer SMT packages discussed in the course.

The course reference for LLP/QFN packages is TI Application Note AN-1187, “Leadless Leadframe Package”: TI AN1187 LLP

And for QFN PCB design, TI “QFN Design Guide”: TI SLMA006 QFN

For any small SMT package, thermal transfer of heat to the board is important. This issue is discussed in TI AN-1520, “A Guide to Board Layout for Best Thermal Resistance for Exposed Packages”:TI AN-1520

Course References:

Thermal Issues, IC:

Texas Instruments “Understanding IC Package Power Capabilities”, http://www.ti.com/lit/an/snva509a/snva509a.pdf

Thermal Issues, PCB:

Ultracad Designs: http://www.ultracad.com/article_outline.htm

Saturn PCB Toolkit: http://www.saturnpcb.com/pcb_toolkit.htm

Blackwell & Hollomon,chapter 5 section 5.8

Texas Instruments application note AN-1520: http://www.ti.com/lit/an/snva183b/snva183b.pdf

High-Speed, By-pass Capacitors:

Ultracad Designs: http://www.ultracad.com/article_outline.htm

Blackwell & Hollomon, chapter 5, section 5-10

Xilinx Vertex-6 PCB Design Guide: http://www.xilinx.com/support/documentation/user_guides/ug203.pdf

Wizards in high-speed design:

Doug Brooks: http://www.ultracad.com

Eric Bogatin: http://bethesignal.com/bogatin

Howard Johnson: http://www.sigcon.com

Lee Ritchey: http://speedingedge.com

Basic soldering for electronics pace handbook of north dakota

General SMT References

General SMT Information:

SMT Net: www.smtnet.com
SMT Magazine: www.smtmagazine.com
Surface MountTechnology Assn.: www.smta.org
Intel Packaging Databook chapter 1, “Component Surface Mount Technology” and chapter 2, “SMT Board Assembly Recommendations”, available at www.intel.com/design/packtech/packbook.htm
Circuit Technology’s newsletter and white papers: www.circuitnet.com
High-speed and bypass capacitor information from UltraCAD Design, Inc., available at www.ultracad.com .

Solder paste information:

Basic Soldering For Electronics Pace Handbook Of North Usa

Amtech Solder: www.amtechsolder.com
Kester Solder: www.kester.com

Hand soldering and rework & repair:

Metcal Corp: www.metcal.com
Pace Corp.:www.paceworldwide.com

Circuit board design:

PCB Design & Fabrication magazine: www.pcdandf.com
PCB Standards for design, manufacturing, and testing, the IPC: www.ipc.org

Lead Free Solder and related Tin Whisker problems:

·IPC Leadfree Site

·NASA Tin Whisker Basics

Basic Soldering For Electronics Pace Handbook Of North Carolina

·Intel Packaging Databook chapter 2, “Component Surface Mount Technology”, available at www.intel.com/design/packtech/packbook.htm

Basic Soldering For Electronics Pace Pdf

This page last updated 08 August, 2014